TOMSK, Oct 2 – RIA Tomsk. Tomsk Polytechnic University (TPU) and the Mikron company signed an agreement on strategic partnership, within the framework of which they will conduct joint research and develop breakthrough industrial electronic technologies, the press service of the university said on Friday.
According to the press service, the agreement on strategic partnership was signed by Acting Rector of TPU Andrey Yakovlev and General Director of PJSC Mikron Gulnara Khasyanova at the international forum "Microelectronics-2020", which was held in Yalta from September 28 to October 3.
"The peculiarity of the partnership between TPU and Mikron - is the focus on the development of ready-made solutions for the growing demand of the industry. We operate in the logic of targeted planning of research, development and training of specialists for ready-made in-demand technology "from chips to hardware and applied software", - Yakovlev is quoted.
© РИА Томск. Таисия Воронцова
It is specified that within the framework of the agreement TPU and Mikron will conduct joint research and develop breakthrough industrial electronic technologies. We are talking about edge computing for IoT and AI applications, equipment and software for telecommunications, analog signal processing, technologies based on quantum effects and bioelectronics, microelectronic bases for working in extreme conditions, for example, in the Arctic, and in the fields of artificial intelligence.
"The partners plan to develop and launch projects to create ultrapure materials, chemical reagents, components and equipment for the production of microelectronics. The necessary infrastructure will be created on the basis of TPU, as well as a system of internships, training programs, student shuttles will be launched", - the press service added.
Mikron Group - is the largest manufacturer and exporter of microelectronics in Russia, a center of expertise and a technology leader in the Russian semiconductor industry. It manufactures over 700 types of products, including integrated circuits for secure storage media, identification, payment and transport documents.